TAIPEI (Reuters) – SK Hynix, the globe’s second-largest reminiscence chip producer, will definitely start automation of HBM3E 12-layer chips by the top of this month, an aged exec said on Wednesday.
Justin Kim, head of state and head of the enterprise’s AI Infra division, made the comment on the Semicon Taiwan sector on-line discussion board in Taipei.
In July, the South Korean enterprise divulged methods to ship the next variations of HBM chips – the 12-layer HBM3E – starting within the 4th quarter and the HBM4 starting within the 2nd fifty % of 2025.
High transmission capability reminiscence (HBM) is a type of vibrant arbitrary acquire entry to reminiscence, or DRAM, typical initially created in 2013 during which chips are up and down piled to preserve space and reduce energy consumption. They are modern reminiscence chips with the flexibility of managing generative skilled system (AI) job.
A vital a part of graphics refining units (GPUs) for AI, it assists process huge portions of data created by difficult purposes.
In May, SK Hynix CHIEF EXECUTIVE OFFICER Kwak Noh-Jung said its HBM chips had been marketed out for this yr and nearly marketed out for 2025.
There are simply 3 main makers of HBM – SK Hynix, Micron and Samsung Electronics.
SK Hynix has truly been the main vendor of HBM chips to Nvidia and supplied HBM3E contribute late March to a shopper it decreased to acknowledge.
(Reporting by Heekyong Yang and Ben Blanchard; Editing by Jacqueline Wong and Christian Schmollinger)
